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Multilayer ceramic (single 200G / single 400G)

TGV technology

  • Glass with a low dielectric constant thickness of about 0.3mm and a pore diameter of 60±5μm

  • Uses copper plating and VIA filling process

  • Signals are transmitted from the back to the front via the TGV, supporting transmission speeds exceeding 100GHz

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SDD21:184GHz

@-3dB

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SCD21:＜-20dB 

@200Ghz


Bridge construction plan

  • Compatible with EML lasers

  • The transmission line step height is 100±5μm, precisely matching the laser intensity

  • The steps use materials with low dielectric constant and low transmission loss

  • The process does not involve ceramic sintering or through-hole electroplating

  • The RF region is isolated from the substrate, ensuring stable performance

  • The substrate is aluminum nitride

  • Verified by key clients

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