Material: optical glass, n=1.5 or 2.0, material thickness 0.2mm~1mm
Uses laser-assisted etching technology
Product Specifications & Process Capability:
1. CA/D:100um~1000um/120um~1200um
2. ROC:180um~5000um
3.K:0~-12
4.Sag:<40um
5.RMS:<60nm
6.Surface Roughness:<5nm
7.Reflectivity@1250~1620nm:<0.3%
8.Verticality:±1.5°
Testing methods: white light interferometer, step meter (column lens)

Material: Monocrystalline silicon, material thickness 0.2~1mm
Product Specifications & Process Capability:
1. CA/D:100~1000um/120~1200um
2.ROC:180~5000um
3.K:0~-12
4.Sag:<40um
5. RMS:<25nm
6.Surface Roughness:<5nm
7.Reflectivity@1250~1620nm:<0.3%
8.Verticality:±1.5°
Test method: White light interferometer (full test)
Application: High-speed optical module TOSA end
Customizable according to actual usage needs: surface metal, mark identification points, glue overflow grooves, etc
