For CPO products

Glass V-Groove

Core Advantages

Ultra-High Precision: Leveraging laser-assisted and high-precision photomask etching technologies, achieving a pitch accuracy of < ±0.3μm with zero cumulative error—meeting the rigorous alignment requirements of CPO (Co-Packaged Optics) scenarios;

Wafer-Level Mass Manufacturing: Supports full-wafer processing for 4-, 6-, and 8-inch wafers; a single wafer can integrate hundreds of channels, satisfying high-volume delivery demands;

Flexible Material Selection: Compatible with BF33, PYREX glass, fused silica, and FOTURAN™ photosensitive glass, allowing for optimal matching with various coefficients of thermal expansion and optical applications;

Terminal Process Compatibility: Product designs are fully compatible with client-side UV-curing assembly workflows, thereby enhancing packaging yield rates.

Application Scenarios

Multi-channel optical communication applications, including optical communication modules, fiber optic connectors, and low-loss PIC connectors;

Critical components for achieving optimal performance in precision optical devices such as FAUs, AWGs, VOAs, PLCs, FTTH systems, and DWDM systems;

Precision alignment for CPO/LPO optical engines.

Technical indicators/specifications