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Evaporation
Wafer Materials Supported
MEMS Assembly
Lithography
Gold/Tin Solder
Wafer Bonding
Evaporation
Sputtering
Etching
RF Simulation
Evaporation
E-beam
<5% uniformity
AL, Ag, Au, Cr, Ni, Pt, SiO2, Sn, Ti
Thickness: 100 Å – 2 µm